Silicon Power Releases DDR3-1333/1066 Dual Channel Pack

Product Features:

* New generation memory module, effectively reduces power consumption by 20% ~ 30%
* Original 128M x8 FBGA modules for better heat dissapation
* Uses Fly-by circuitry design for efficient communications between DRAM modules and the controller
* On-DIE Termination (ODT) technology dramatically reduces unwanted reflection signals and maximizes speed
* Uses original memory modules, FBGA packaging and ruggedly tested under dual channel operation
* Stable, durable and highly compatible

Product Specifications

* Memory type: DDR3 Memory
* Memory pin: 240Pin Long-DIMM
* Operating frequency: DDR3-1333MHz / DDR3-1066MHz
* Mode of operation: Unbuffer Non-ECC Memory
* Capacity: 4GB(2GB*2) / 2GB(1GB*2)
* Module: 128Mx8 (bit) (single module)
* Operating voltage: 1.5 V
* CAS latency：9 (1333MHz) / 7 (1066MHz)
* Warranty: Lifetime

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